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publication number s71ws-p_00 revision a amendment 10 issue date october 19, 2007 s71ws-p based mcp products s71ws-p based mcp products cover sheet 1.8 volt-only x16 simultaneo us read/write, burst mode flash memory with cellularram data sheet notice to readers: this document states the current techni cal specifications regarding the spansion product(s) described herein. each product describ ed herein may be designated as advance information, preliminary, or full production. see notice on data sheet designations for definitions.
2 s71ws-p based mcp products s71ws-p_00_a10 october 19, 2007 data sheet notice on data sheet designations spansion inc. issues data sheets with advance informati on or preliminary designations to advise readers of product information or int ended specifications throu ghout the product life cycle, including development, qualification, initial production, and fu ll production. in all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. the following descriptions of spansion data sheet designations are presented here to highlight their presence and definitions. advance information the advance information designation indicates that spansion inc. is developing one or more specific products, but has not committed any design to production. information pr esented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. spansion inc. therefore places the following c onditions upon advance information content: ?this document contains information on one or mo re products under development at spansion inc. the information is intended to help you evaluate th is product. do not design in this product without contacting the factory. spansion inc. reserves t he right to change or discont inue work on this proposed product without notice.? preliminary the preliminary designation indicates that the produc t development has progressed such that a commitment to production has taken place. this designation covers several aspects of the product life cycle, including product qualification, initial produc tion, and the subsequent phases in t he manufacturing process that occur before full production is achieved. changes to the technical specifications presented in a preliminary document should be expected while keeping these as pects of production under consideration. spansion places the following conditions upon preliminary content: ?this document states the current technical sp ecifications regarding the spansion product(s) described herein. the preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. due to the phases of the manufacturing process that require maintaining efficiency and quality, this doc ument may be revised by subsequent versions or modifications due to changes in technical specifications.? combination some data sheets contain a combination of products with different designations (advance information, preliminary, or full production). this type of docum ent distinguishes these prod ucts and their designations wherever necessary, typically on the first page, t he ordering information page, and pages with the dc characteristics table and the ac erase and program ta ble (in the table notes). the disclaimer on the first page refers the reader to the notice on this page. full production (no designation on document) when a product has been in production for a period of time such that no changes or only nominal changes are expected, the preliminary designation is remove d from the data sheet. nominal changes may include those affecting the number of ordering part numbers available, such as t he addition or deletion of a speed option, temperature range, package type, or v io range. changes may also include those needed to clarify a description or to correct a typographical error or incorre ct specification. spansion inc. applies the following conditions to documents in this category: ?this document states the current technical sp ecifications regarding the spansion product(s) described herein. spansi on inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. however, typographical or specification corrections, or mo difications to the valid comb inations offered may occur.? questions regarding these docum ent designations may be directed to your local sales office.
publication number s71ws-p_00 revision a amendment 10 issue date october 19, 2007 features ? power supply voltage of 1.7 to 1.95v ? flash access time: 80 ns, 25 ns ? flash burst frequencies: 66 mhz, 80 mhz, 108 mhz ? psram access time: 70 ns, 20 ns ? psram burst frequency: 66 mhz, 80 mhz, 104 mhz ? package: ? 8.0 x 11.6 mm mcp ? operating temperature ? ?25c to +85c (wireless) the s71ws series is a product line of stacked packages and consists of: ? one or two s29ws-p nor flash memory die ? cellularram die the products covered by this document are listed in the table below. note: for a full list of opns, please contact the local sales representa tive or refer to the ordering information valid combinations tables. for detailed specifications, please refer to the individual data sheets. s71ws-p based mcp products 1.8 volt-only x16 simultaneo us read/write, burst mode flash memory with cellularram data sheet device cellularram density (mb) 64 mb 128 mb s29ws512p s71ws512pc0 s71ws512pd0 s29ws256p s71ws256pc0 s71ws256pd0 s29ws128p s71ws128pc0 document publication identification number (pid) s29ws-p s29ws-p_00 128 m cellularram type 2 cellram_04 128 m/64 m cellularram type 3 cellram_07 cellurlar ram application note for qimonda cellram_sw_reg_entry_an
4 s71ws-p based mcp products s71ws-p_00_a10 october 19, 2007 data sheet 1. product selector guide device model number flash density (mb) cellularram density (mb) flash speed (mhz) cellularram speed (mhz) cellularram supplier package s71ws512pd0hf3 hl 512 128 104 104 type 2 84 ball mcp 8x11.6x1.2 mm s71ws512pd0hf3 sl 104 s71ws512pd0hf3 sr 80 s71ws512pc0hf3 sl 512 64 104 104 type 2 84 ball mcp 8x11.6x1.2 mm s71ws512pc0hf3 sr 80 s71ws512pc0hf3 sv 66 s71ws512pc0hf3 s2 54 s71ws512pc0hf3 sw asynchronous s71ws256pd0hf3 hl 256 128 104 104 type 2 84 ball mcp 8x11.6x1.2 mm s71ws256pd0hf3 hr 80 s71ws256pd0hf3 sl 104 104 type 2 s71ws256pd0hf3 sr 80 s71ws256pd0hf3 sv 66 s71ws256pd0hf3 tl 104 104 type 3 s71ws256pc0hf3 sl 256 64 104 104 type 2 s71ws256pc0hf3 sr 80 s71ws256pc0hf3 sv 66 s71ws128pc0hf3 sl 128 64 104 104 type 2 84 ball mcp 8x11.6x1.2 mm s71ws128pc0hf3 sr 80 s71ws128pc0hf3 sv 66 s71ws128pc0hf3 tr 128 64 80 104 type 3
october 19, 2007 s71ws-p_00_a10 s71ws-p based mcp products 5 data sheet 2. mcp block diagram a0-amax a0-amax aflash aflash rdy rdy dq0-dq15 clk clk avd# avd# f-ce# ce# oe# oe# f-rst# reset# vss vss f-acc acc f-wp# wp# f-we# we# vcc f-vcc vccq f-vccq a0-amax wait# clk avd# r-ce# ce# oe# r-lb# lb# r-ub# ub# we# r-cre cre vss vcc r-vcc vccq dq0-dq15 dq0-dq15 ws-p flash memory psram memory
6 s71ws-p based mcp products s71ws-p_00_a10 october 19, 2007 data sheet 3. connection diagrams note 1. v cc pins must ramp simultaneously. 3.1 special handling instru ctions for fbga package special handling is required for flash memory products in fbga packages. flash memory devices in fbga packages may be damaged if exposed to ultrasonic cleaning methods. the package and/or data integrity may be compromised if t he package body is exposed to temperatures above 150c for prolonged periods of time. 3.2 look-ahead ballout for future designs please refer to the design-in scalable wireless solutions with spansion products application note (publication number: design_scalable_wir eless_a0_e). contact your local spansion sales representative for more details. mcp flash-only addresses shared addresses s71ws512pd0 a24-a23 a22-a0 s71ws512pc0 a24-a22 a21-a0 s71ws256pd0 a24-a23 a22-a0 s71ws256pc0 a24-a22 a21-a0 s71ws128pc0 a24-a22 a21-a0 3 2910 5 47 68 1 dnu dnu b d e f g h j k l m a c vss avd# rfu rfu clk rfu f-vcc rfu a7 f-wp# rfu f-acc r-lb# a8 we# a11 a6 a3 a15 f-rst# r-ub# a19 rfu a12 a5 a2 a21 rdy a18 a9 a20 a13 a4 a1 a22 rfu a17 a10 a23 a14 vss a0 a16 rfu dq1 dq6 rfu a24 oe# f-ce# r-cre dq3 dq9 dq13 dq4 dq15 dq0 r-ce# vss f-vcc dq10 dq12 r-vcc dq7 dq8 rfu rfu dq11 dq2 dq5 rfu dq14 rfu rfu dnu f-vcc vss rfu rfu f-vccq dnu dnu legend flash & psram shared only do not use nor flash only reserved for future use psram only
october 19, 2007 s71ws-p_00_a10 s71ws-p based mcp products 7 data sheet 3.3 nor flash and psram in put/output descriptions signal description flash psram amax-a0 nor flash address inputs x x dq15-dq0 flash data input/output, shared between nor and ornand flash. dq0-dq7 shared for x8 ornand xx f-ce# nor flash chip-enable input #1. asynchronous relative to clk for burst mode. x oe# output enable input. asynchronous relative to clk for burst mode. x x we# write enable input. xx f-v cc nor flash device power supply (1.7 v - 1.95 v). x f-v ccq input/output buffer power supply. x v ss ground xx rfu reserved for future use rdy flash ready output. indicates the status of the burst read. v ol = data valid. the flash rdy pin is shared with the wait pin of the psram. xx clk nor flash clock, shared with clk of burst-mode psram.. the first rising edge of clk in conjunction with avd# low latches the address input and activates burst mode operation. after the initial word is output, subsequent rising edges of clk increment the internal address counter. clk should remain low during asynchronous access. xx avd# nor flash address valid input. shared with avd# of burst-mode psram. indicates to device that the valid address is present on the address inputs. v il = for asynchronous mode, indicates valid address; for burst mode, causes starting address to be latched on rising edge of clk. v ih = device ignores address inputs xx f-rst# nor flash hardware reset input. v il = device resets and returns to reading array data x f-wp# nor flash hardware write protect input. v il = disables program and erase functions in the four outermost sectors. x f-acc nor flash accelerated input. at v hh , accelerates programming; automatically places device in unlock bypass mode. at v il , disables all program and erase functions. should be at v ih for all other conditions. x r-ce# chip-enable input for psram x r-cre control register enable (psram). for cellularram only. x r-vcc psram power supply x r-ub# upper byte control (psram) x r-lb# lower byte control (psram) x dnu do not use
8 s71ws-p based mcp products s71ws-p_00_a10 october 19, 2007 data sheet 4. ordering information the order number is formed by a valid combinations of the following: s71ws 512 p d0 hf 3 h l 0 packing type 0 = tray 2 = 7? tape and reel 3 = 13? tape and reel model number 2 l = 104 mhz flash speed r = 80 mhz flash speed v = 66 mhz flash speed 2 = 54 mhz flash speed w = asynchronous model number 1 h = cellularram type 2, dyb = 1, ppb = 0 s = cellularram type 2, dyb = 1, ppb = 1 t = cellularram type 3, dyb = 1, ppb = 1 package descriptor depends on character 12. for a more detailed description see table 4.1 . package type & material set hf = 1.2 mm mcp fbga, pb-free kf = 1.2 mm pop fbga, pb-free jf = 1.4 mm mcp fbga, pb-free cellularram density d0 = 128 mb c0 = 64 mb process technology p = 90 nm, mirrorbit tm technology code flash density 512 = 512 mb 256 = 256 mb 128 = 128 mb product family s71ws stacked products (mcp/pop) 1.8 v nor flash with psram
october 19, 2007 s71ws-p_00_a10 s71ws-p based mcp products 9 data sheet 4.1 valid combinations valid combinations list configurations planned to be supported in volume for this device. consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. notes: 1. packing type 0 is standard. specify other options as required. 2. bga package marking omits leading s and packing type designator from ordering part number. table 4.1 character position descriptions character 12 character 14 character 14 description package area package ball count raw ball size h or j 07x9mm56 0.35 mm 17x9 mm80 2 8x11.6 mm 64 3 8x11.6 mm 84 4 9x12 mm 84 5 9x12 mm 115 6 9x12 mm 137 7 11x13 mm 84 8 11x13 mm 115 9 11x13 mm 137 k a 11x11 mm 112 0.45 mm b 11x11 mm 112 0.50 mm d 12x12 mm 128 0.45 mm f 12x12 mm 128 0.50 mm g 14x14 mm 152 0.45 mm h 14x14 mm 152 0.50 mm j 15x15 mm 160 0.45 mm k 15x15 mm 160 0.50 mm l 17x17 mm 192 0.45 mm m 17x17 mm 192 0.50 mm valid combination product family code flash denisty (mb) process technology cellularram density package type / material model number combo flash & cellularram speed packing type cellularram type / dyb/ppb s71ws 128 p c0, d0 hf3 h r,l 0,2,3 (note 1) 256 s w,2,v,r,l 512 tr,l d0 jf4 h r,l
10 s71ws-p based mcp products s71ws-p_00_a10 october 19, 2007 data sheet 5. physical dimensions 5.1 tla084? 84-ball fine pitch ball gr id array (fbga) 8x11.6mm package 3372-2 \ 16-038.22a package tla 084 jedec n/a d x e 11.60 mm x 8.00 mm package symbol min nom max note a --- --- 1.20 profile a1 0.17 --- --- ball height a2 0.81 --- 0.97 body thickness d 11.60 bsc. body size e 8.00 bsc. body size d1 8.80 bsc. matrix footprint e1 7.20 bsc. matrix footprint md 12 matrix size d direction me 10 matrix size e direction n 84 ball count ? b 0.35 0.40 0.45 ball diameter ee 0.80 bsc. ball pitch ed 0.80 bsc ball pitch sd / se 0.40 bsc. solder ball placement a2,a3,a4,a5,a6,a7,a8,a9 depopulated solder balls b1,b10,c1,c10,d1,d10, e1,e10,f1,f10,g1,g10, h1,h10,j1,j10,k1,k10,l1,l10, m2,m3,m4,m5,m6,m7,m8,m9 notes: 1. dimensioning and tolerancing methods per asme y14.5m-1994. 2. all dimensions are in millimeters. 3. ball position designation per jesd 95-1, spp-010. 4. e represents the solder ball grid pitch. 5. symbol "md" is the ball matrix size in the "d" direction. symbol "me" is the ball matrix size in the "e" direction. n is the number of populted solder ball positions for matrix size md x me. 6 dimension "b" is measured at the maximum ball diameter in a plane parallel to datum c. 7 sd and se are measured with respect to datums a and b and define the position of the center solder ball in the outer row. when there is an odd number of solder balls in the outer row sd or se = 0.000. when there is an even number of solder balls in the outer row, sd or se = e/2 8. "+" indicates the theoretical center of depopulated balls. 9. n/a 10 a1 corner to be identified by chamfer, laser or ink mark, metallized mark indentation or other means. c 0.08 0.20 c a e b c 0.15 (2x) c d c 0.15 (2x) index mark 10 6 b top view side view corner 84x a1 a2 a 0.15 c a b m c m 0.08 pin a1 ml e1 7 se a d1 ed dc e f g h j k 10 8 9 7 6 4 3 2 1 ee 5 b pin a1 corner 7 sd bottom view
october 19, 2007 s71ws-p_00_a10 s71ws-p based mcp products 11 data sheet 6. revision history 6.1 revision a (february 21, 2006) initial release. 6.2 revision a1 (april 12, 2006) added the s71ws512pc0 6.3 revision a2 (august 21, 2006) added the s71ws512pd0 108mhz opn 6.4 revision a3 (november 7, 2006) added the s71ws256pd0 mcp added the s71ws256pc0 mcp 6.5 revision a4 (december 8, 2006) added new cellularram type 3 revised valid combination table revised product selector guide 6.6 revision a5 (january 11, 2007) added s71ws128pc0 mcp offering 6.7 revision a6 (february 5, 2007) added the s71ws512pd0jf4 opn 6.8 revision a7 (march 27, 2007) added the s71ws512pd0hf3sr opn 6.9 revision a8 (july 30, 2007) added 80 mhz s71ws128pc0 to valid combinations 6.10 revision a9 (september 4, 2007) added 54 mhz and asynchronous s71ws512pc0 mcp revised valid combinations 6.11 revision a10 (october 19, 2007) add 104 mhz, 80 mhz and 66 mhz s71ws256pc, s71ws256pd and s71ws128pc mcp products removed the s71ws512pd0jf mcp
12 s71ws-p based mcp products s71ws-p_00_a10 october 19, 2007 data sheet colophon the products described in this document are designed, developed and manufactured as contemplated for general use, including wit hout limitation, ordinary industrial use, genera l office use, personal use, and household use, but are not designed, developed and m anufactured as contemplated (1) for any use that includes fatal risks or dangers t hat, unless extremely high safety is secured, could have a s erious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic contro l, mass transport control, medical life support system, missile launch control in we apon system), or (2) for any use where chance of failure is intole rable (i.e., submersible repeater and artifi cial satellite). please note that spansion will not be liable to you and/or any third party for any claims or damages arising in connection with abo ve-mentioned uses of the products. any semic onductor devices have an inherent chance of failure. you must protect agains t injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. if any products described in this document r epresent goods or technologies s ubject to certain restriction s on export under the foreign exchange and foreign trade law of japan, the us export ad ministration regulations or the applicable laws of any oth er country, the prior authorization by the respective government entity will be required for export of those products. trademarks and notice the contents of this document are subjec t to change without notice. this document ma y contain information on a spansion product under development by spansion. spansion reserves the right to change or discontinue work on any product without notice. the informati on in this document is provided as is without warran ty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. spansion assume s no liability for any damages of any kind arising out of the use of the information in this document. copyright ? 2006-2007 spansion inc. all rights reserved. spansion ? , the spansion logo, mirrorbit ? , mirrorbit ? eclipse ? , ornand ? , hd-sim ? and combinations thereof, are trademarks of spansion llc in the us and other countries . other names used are for informational purposes only and may be trademarks of their respective owners.

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